MMEYATU

Manufacturing Center

See the lines. Know the equipment. Verify the process.

Full SMT, through-hole, box-build and test capability under one roof in Changsha — the same lines that have shipped medical, automotive and industrial electronics since 2002. US orders are produced and shipped from this facility.

Process

Standard build flow

Every unit follows the same routed process with full traceability records.

SMT

  1. 01

    Solder Paste Printing

    Stencil printing with SPI (solder paste inspection) on 100% of boards before placement.

  2. 02

    Component Placement

    High-speed and flexible placers handle 01005 passives up to fine-pitch BGA and connectors.

  3. 03

    Reflow Soldering

    Multi-zone reflow with profiled thermal curves per board type, logged per batch.

  4. 04

    AOI Inspection

    Automated optical inspection on all SMT-side joints; X-ray for BGA and hidden joints.

DIP

  1. 01

    Through-Hole Assembly

    Wave or selective soldering for through-hole components and connectors.

Test

  1. 01

    In-Circuit Test

    ICT validates assembly integrity and component values before functional test.

  2. 02

    Functional Test

    Customer-specific functional test fixtures verify the assembled unit end-to-end.

Finishing

  1. 01

    Conformal Coating

    Optional conformal coating per IPC-CC-830 for harsh-environment and power products.

  2. 02

    Box Build & Packing

    Enclosure assembly, firmware loading, EOL test and retail-ready packaging.

Equipment

Production equipment

A representative list of the lines running in Changsha today.

SMT Placement equipment at MEYATU
SMT Placement equipment at MEYATU
SMT Placement equipment at MEYATU
SMT Placement equipment at MEYATU

SMT Placement

  • JUKI KE-2070E

    Flexible mounter

    Fine-pitch and IC placement

  • JUKI KE-2080E

    Flexible mounter

    Mid-volume IC and chip placement

  • JUKI FX-3RL

    High-speed mounter

    Ultra-high-speed chip placement

Automated Inspection equipment at MEYATU

Automated Inspection

  • AOI station

    Automated optical inspection

    100% of SMT-side joints

Solder Paste Printing equipment at MEYATU
Solder Paste Printing equipment at MEYATU

Solder Paste Printing

  • Automatic stencil printer

    Solder paste printer

    With SPI paste inspection

Reflow & Soldering equipment at MEYATU
Reflow & Soldering equipment at MEYATU

Reflow & Soldering

  • JT AS-1000

    Reflow oven

    Multi-zone profiled reflow

  • Selective soldering

    Selective solder

    Through-hole and connector soldering

Rework & Repair equipment at MEYATU
Rework & Repair equipment at MEYATU

Rework & Repair

  • BGA rework station

    BGA rework

    Dual-vision BGA/QFN removal and replacement

  • Merway soldering robot

    Automated soldering

    Consistent automated soldering for high-mix runs

Board Handling & Feeding equipment at MEYATU
Board Handling & Feeding equipment at MEYATU

Board Handling & Feeding

  • SMT feeder station

    Component feeding

    Tape-and-reel feeding for high-mount lines

  • PCB depanelizer

    Depaneling

    Router and punch depaneling

  • PCBA cleaning

    Cleaning

    Flux residue cleaning for high-reliability builds

Equipment photographs show the machines running on our floor today. Brands shown are the equipment OEMs, not customer products.

Facility

Inside the Changsha facility

SMT, through-hole, assembly and test under one roof — photographed on our production floor. This is the facility that produces and ships US orders.

MEYATU production floor, Changsha, China
MEYATU production floor, Changsha, China
MEYATU production floor, Changsha, China
MEYATU production floor, Changsha, China
MEYATU production floor, Changsha, China

Capacity

Capacity at a glance

Figures below are pending final company confirmation before publication — values marked unconfirmed are not shown to visitors.

2002

Manufacturing since

Changsha, China

Production & shipping base

Detailed line-count, headcount and daily-output figures are being finalized with our operations team. Ask your engineering contact for current capacity during quoting.

Process control

How the process stays honest

Controls that run on every build — not audit-day theater.

ESD control

Full ESD S20.20 program — grounded workstations, smocks, wrist straps and daily audits.

Moisture control

MSD handling and baking per J-STD-020 / J-STD-033 for moisture-sensitive components.

Traceability

Board-level serialization; per-unit process records retained for customer audits.

Inspection discipline

SPI, AOI and X-ray on SMT joints; 100% ICT or FCT before shipment.

First article control

FAI on every new build; sign-off required before volume release.

Change control

No unapproved process, component or source changes — ECN discipline with customer notification.

Factory tour video

A 2–3 minute walkthrough of the Changsha floor — receiving to packing — is in production. Ask for the preview link, or request it with your quote.

See it before you commit

Photos show equipment; video shows how a program actually moves through it. US customers can request a live video walkthrough of their own build area before first article approval.

Ready to put your build on these lines?

Send your BOM or Gerbers. You get a manufacturability review before anyone talks price.